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Effect of Heat Treatment on Fracture Behavior of Normal Sintered Silicon Nitride

作者:HAYATO NANRI;MAKOTO ISHIKAWA;

作者单位:Taiko Refractories Co., Ltd. 1-1, Makiyama Shinmachi, Tobata-ku, Kitakyusyu-shi 804-0054

刊名:Taikabutsu Overseas

ISSN:0285-0028

出版年:2002-01-05

卷:22

期:3

起页:227

止页:230

分类号:TQ175

语种:英文

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内容简介

The modulus of rupture of normal sintered Si_3N_4 containing Al_2O_3 and Y_2O_3 as auxiliary sintering agents declined after heat treatment at 1200-1400 deg C for 1 to 5 hrs in an Argon atmosphere. The reduction in modulus of rupture increased with increasing heat treatment temperature. Amounts of displacement in the case of heat treatment at 1200 and 1300 deg C for 3 hrs were larger than those before heat treatment. Especially, displacement in the case of heat treatment at 1200 deg C for 3 hrs was largest, showing four times as large displacement as that before heat treatment. The mass loss increased linearly with heating time and the apparent porosity also increased with increasing heat treatment temperature for all holding times.

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